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Volumn 16, Issue 5, 2005, Pages 511-514
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Study on thermal performances of flip-chip high-power white LEDs
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Author keywords
Chip size; Finite element method (FEM); High power LED; Temperature
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Indexed keywords
ENERGY DISSIPATION;
FINITE ELEMENT METHOD;
HEAT TRANSFER;
MATHEMATICAL MODELS;
TEMPERATURE DISTRIBUTION;
CHIP SIZE;
HIGH-POWER LED;
LIGHT EMITTING DIODES;
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EID: 21144450236
PISSN: 10050086
EISSN: None
Source Type: Journal
DOI: None Document Type: Article |
Times cited : (31)
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References (8)
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