Effects of electrostatic and van der Waals interactions on the Adhesion of Spherical 7 μm particles

Journal of Adhesion

Volumn 81, Issue 3-4, 2005, Pages 245-269

  Rimai, Donald S ^a   Ezenyilimba, M C ^a   Quesnel, D J ^b  

^a EASTMAN KODAK COMPANY   (United States)

^b UNIVERSITY OF ROCHESTER   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CENTRIFUGATION; COATING TECHNIQUES; ELECTROSTATICS; PARTICLE SIZE ANALYSIS; PARTICLES (PARTICULATE MATTER); PHOTOCONDUCTING MATERIALS; POLYESTERS; SUBSTRATES; VAN DER WAALS FORCES;

ELECTROSTATIC INTERACTIONS; PARTICLE CHARGE-TO-MASS RATIO; PHOTOCONDUCTING SUBSTRATE; POLYMERIC SUBSTRATE; SPHERICAL PARTICLES; ULTRACENTRIFUGATION; VAN DER WAALS INTERACTIONS;

ADHESION;

EID: 21044444608     PISSN: 00218464     EISSN: None     Source Type: Journal    
DOI: 10.1080/00218460590944549     Document Type: Article

References (37)

1. DePalma, V. M., Photographic Sci. Engin. 26, 198 (1982).
2. Gady, B., Schleef, D., Reifenberger, R., and Rimai, D. S., J. Adhesion 67, 291 (1998).
3. Goel, N. S. and Spencer, P. R., Polymer Sci. Technol. 9B, 763 (1975).
4. Krupp, H., Adv. Colloid Interface Sci. 1, 111 (1967).
5. Maugis, D. and Pollock, H. M., Acta Metall. 32, 1323 (1984).
6. Rimai, D. S., DeMejo, L. P., and Bowen, R. C., J. Appl. Phys. 68, 6234 (1990).
7. Rimai, D. S., Moore, R. S., Bowen, R. C., Smith, V. K., and Woodgate, P. E., J. Mater. Res. 8, 662 (1993).
8. Hays, D. A., Photographic Sci. Engin. 22, 232 (1978).
9. Hays, D. A. and Wayman, W. H., Inst. Phys. Conf. Ser. No. 66: Electrostatics, 237-242 (1983).
10. Hays, D. A. and Wayman, W. H., J. Imag. Sci. 33, 160 (1989).
11. Eklund, E. A., Wayman, W. H., Brillson, L. J., and Hays, D. A., IS&T's Tenth International Congress on Advances in Non-Impact Printing Technologies, 142-146 (1994).
12. Mastrangelo, C. J., Photographic Sci. Engin. 26, 194 (1982).
13. Nebenzahl, L., Borgioli, J., De Palma, V., Gong, K., Mastrangelo, C., and Pourroy, F., Photographic Sci. Engin. 24, 293 (1980).
14. Hays, D. A., in Advances in Particle Adhesion, D. S. Rimai and L. H. Sharpe (Eds.) (Gordon and Breach Publishers, 1996), pp. 41-48.
15. Donald, D. K., J. Appl. Phys. 40, 3013 (1969).
16. Donald, D. K. and Watson, P. K., Photographic Sci. Engin. 14, 36 (1970).
17. Lee, M. H., and Jaffe, A. B., in Particles on Surfaces 1: Detection, Adhesion, and Removal, K. L. Mittal (Ed.) (Plenum, New York, 1988), pp. 169-178.
18. Bowling, R. A., in Particles on Surfaces 1: Detection, Adhesion, and Removal, K. L. Mittal (Ed.), (Plenum, New York, 1988), pp. 129-142.
19. Rimai, D. S., Quesnel, D. J., DeMejo, L. P., and Regan, M. T., J. Imag. Sci. Technol. 45, 179 (2001).
20. Rimai, D. S. and Quesnel, D. J., J. Adhesion 78, 413-429 (2002).
21. Gady, B., Reifenberger, R., Rimai, D. S., and DeMejo, L. P., Langmuir 13, 2533 (1997).
22. Rimai, D. S., Weiss, D. S., and Quesnel, D. J., J. Adhesion Sci. Technol. 17, 917-942 (2003).
23. Hays, D. A., in Fundamentals of Adhesion and Interfaces, D. S. Rimai, L. P. DeMejo, and K. L. Mittal (Eds.), (VSP, Utrecht, 1995), pp. 67-71.
24. Fuller, K. N. G. and Tabor, D., Proc. R. Soc. London A 345, 327-342 (1975).
25. Iimura, H., Kurosu, H., and Yamaguchi, T., Proc. IS&T's NIP15: International Conference on Digital Printing Technologies, 535-538 (1999).
26. Gady, B., Quesnel, D. J., Rimai, D. S., Leone, S., and Alexandrovicb, P., J. Imag. Sci. Technol. 43, 289 (1999).
27. Rimai, D. S. and Quesnel, D. J., Fundamentals of Particle Adhesion (Global Press, Moorhead, MN, 2001). Available from the Adhesion Society.
28. Rimai, D. S., Alexandrovich, P., and Quesnel, D. J., J. Adhesion (in press).
29. Nair, M., Pierce, Z. R., and Diprima, D. A., U.S. Patent 4,965,131 (1990).
30. Maher, J. C., Proc. IS&T's Tenth International Congress on Non-Impact Printing, IS&T, Springfield, pp. 156-159 (1994).
31. Miskinis, E. T.; Proc. 6th International Congress on Non-Impact Printing, IS&T, Springfield, pp. 101-110 (1990).
32. Lundy, D. A., Jugle, K. L., MacDonald, D. W., Berman, R. W., and Hurwitch, C. B., U.S. Patent #5,151,744 (1992).
33. Sugimoto, H., Kai, M., and Arai, M., U.S. Patent #5,510,886 (1996).
34. Komatsubara, S., Yuasa, K., Endoh, S., Matsumae, I., Tanaka, Y., Takenaka, E., Sugiyama, T., Yamanaka, T., and Murakami, E., U.S. Patent #5,666,625 (1997).
35. Krishnan, S., Busnaina, A. A., Rimai, D. S., and DeMejo, L. P., J. Adhesion Sci. Technol. 8, 1357 (1994).
36. Johnson, K. L., Kendal, K., and Roberts, A. D., Proc. R. Soc. London, Ser. A, 345, 327 (1971).
37. Fowlkes, Y. and Robinson, K. S., in Particles on Surfaces 1: Detection, Adhesion, and Removal, K. L. Mittal (Ed.), (Plenum Press, New York, 1988), pp. 143-155.