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Volumn 28, Issue 2, 2005, Pages 303-310

Study of assembly processes for liquid crystal on silicon (LCoS) microdisplays

Author keywords

Capillary fluid flow; Cell gap; Lamination; Liquid crystal (LC) filling model; Liquid crystal on silicon (LCoS); Microdisplay assembly; Squeeze film

Indexed keywords

ADHESIVES; CAPILLARY FLOW; DEPOSITION; GLASS BONDING; LAMINATING; MATHEMATICAL MODELS; PRESSURE EFFECTS; SEMICONDUCTING SILICON; SEMICONDUCTOR DEVICE MANUFACTURE; VACUUM APPLICATIONS;

EID: 21044434659     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2005.848500     Document Type: Article
Times cited : (15)

References (8)
  • 5
    • 4444311042 scopus 로고    scopus 로고
    • "Study of assembly processes for liquid crystal on silicon (Lcos) microdisplays"
    • M.S. thesis, Mech. Dept., State Univ. New York Binghamton
    • A. Choubey, "Study of assembly processes for liquid crystal on silicon (Lcos) microdisplays," M.S. thesis, Mech. Dept., State Univ. New York Binghamton, 2003.
    • (2003)
    • Choubey, A.1
  • 6
    • 21044433281 scopus 로고    scopus 로고
    • "Numerical modeling of the flow of encapsulants through an array of solder bumps"
    • M.S. thesis, Mech. Dept., State Univ. New York, Binghamton
    • Y. Khamliche, "Numerical modeling of the flow of encapsulants through an array of solder bumps," M.S. thesis, Mech. Dept., State Univ. New York, Binghamton, 2001.
    • (2001)
    • Khamliche, Y.1
  • 8
    • 0030121020 scopus 로고    scopus 로고
    • "Underfill flow as viscous flow between parallel plates driven by capillary action"
    • Apr
    • M. K. Schwiebert and W. H. Leong, "Underfill flow as viscous flow between parallel plates driven by capillary action," IEEE Trans. Compon. Packag. Manufact. Technol. C, vol. 19, no. 2, pp. 133-137, Apr. 1996.
    • (1996) IEEE Trans. Compon. Packag. Manufact. Technol. C , vol.19 , Issue.2 , pp. 133-137
    • Schwiebert, M.K.1    Leong, W.H.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.