Feasibility study of unconventional cooling of electronic components by vibrating plates at close proximity

Numerical Heat Transfer; Part A: Applications

Volumn 47, Issue 10, 2005, Pages 997-1024

  Florio, Laurie A ^a   Harnoy, Avraham ^a  

^a NEW JERSEY INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPONENTS; COMPUTER SIMULATION; HEAT CONVECTION; HEAT FLUX; OSCILLATIONS; PLATES (STRUCTURAL COMPONENTS); VIBRATIONS (MECHANICAL);

COOLING RATES; DIMENSIONS; KINEMATIC VISCOSITY; MODIFIED VELOCITY;

COOLING;

EID: 20744460455     PISSN: 10407782     EISSN: None     Source Type: Journal    
DOI: 10.1080/10407780590926471     Document Type: Article

References (37)

1. L. T. Yeh, Review of Heat Transfer Technologies in Electronic Equipment, J. Electron. Pack., Trans. ASME, vol. 117, pp. 333-337, 1995.
2. R. E. Simmons, The Evolution of IBM High Performance Cooling Technology, IEEE Trans. Components, Pack. Manuf. Technol. A, vol. 118, pp. 805-811, 1995.
3. F. P. Incropera, Liquid Cooling of Electronics Devices, pp. 1-14, Wiley, New York, 1999.
4. R. Viswanath, Thermal Performance Challenges from Silicon to Systems, Intel Journal Q3, www.intel.com, 2000.
5. J. S. Go, Design of a Microfilm Array Sink Using Flow-Induced Vibrations to Enhance the Heat Transfer in the Laminar Flow Regime, Sens. Actuators A Phys., vol. 105, pp. 201-210, 2003.
6. T. C. Hung and C. S. Fu, Conjugate Heat Transfer Analysis for the Passive Enhancement of Electronic Cooling Through Geometric Modification in a Mixed Convection Domain, Numer. Heat Transfer A., vol. 35, pp. 519-535, 1999.
7. S. Sathe, A Review of Recent Developments in Some Practical Aspects of Air-Cooled Electronic Packages, J. Heat Transfer, vol. 120, pp. 830-838, 1998.
8. F. P. Incropera, Future Research Directions, in W. Aung (ed.), Cooling Technology For Electronic Equipment, pp. 800-821, Hemisphere, New York, 1988.
9. V. H. Adams, Y. Joshi, and D. L. Blackburn, Three Dimensional Study of Combined Conduction, Radiation, and Natural Convection from Discrete Heat Sources in a Horizontal Narrow-Aspect-Ratio Enclosure, J. Heat Transfer, vol. 121, pp. 992-1001, 1999.
10. A. Kruusing, Heat Transfer Enhancement at Solid-Liquid and Solid-Gas Interfaces by Near Surface Cooling Agitation, IEEE Trans. Components Pack. Technol. vol. 23, pp. 548-554, 2000.
11. P. Burman, A. Raman, and Suresh Garimella, Dynamics and Topology Optimization of Piezoelectric Fans, IEEE Trans. Components Pack. Technol. vol. 24, pp. 592-600, 2003.
12. J. H. Yoo, J. I. Hong, and W. Cao, Piezoelectric Ceramic Bimorph Coupled to Thin Metal late as Cooling Fan for Electronic Devices, Sens. Actuators A Phys., vol. 79, pp. 8-12, 2000.
13. History of Piezoelectricity and Piezo Systems, Inc., Product Catalog, Retrieved September 22, 2002 from www.piezo.com.
14. M. J. Lighthill, The Response of Laminar Skin Friction and Heat Transfer to Fluctuations in the Stream Velocity, Proc. Roy. Soc. Lond. A, vol. 224, pp. 1-23, 1954.
15. S. Ostrach, Compressible Boundary Layer and Heat Transfer for Unsteady Motions of a Flat Plate, Lewis Flight Propulsion Laboratory, National Advisory Committee for Aeronautics Technical Note 3569, Cleveland, OH, 1955.
16. R. Anantanarayanan and A. Ramachandran, Effect of Vibration on Heat Transfer from a Wire to Air in Parallel Flow, Proc. ASME HTD Annual Meeting, Paper 57-A-100, pp. 1426-1432, ASME, New York, 1957.
17. A. Gopinath and A. F. Mills, Convective Heat Transfer From a Sphere Due to Acoustic Streaming, J. Heat Transfer, vol. 115, pp. 332-341, 1993.
18. R. E. Forbes, Vibration Effects on Convective Heat Transfer in Enclosures, Proc. ASME Heat Transfer Division Winter Annual Meeting, Paper 69-WA/HT-13, 1969.
19. Z. D. Chen, Effects of an Oscillating Interface on Heat Transfer, Chem. Eng. Sci., vol. 52, pp. 3265-3275, 1997.
20. H. J. Huang, K. T. Yang, and V. W. Nee, Simulation of Forced Air Cooling of a Discrete Heat Source in an Open Enclosure by Zero-Mean Oscillatory Flows, EEP - Adv. Electron, Pack. ASME, vol. 10-2, pp. 795-800, 1995.
21. Q. D. Liao, K. T. Yang, and V. W. Nee, Enhanced Microprocessor Chip Cooling by Channeled Zero-Mean Oscillatory Air Flow, EEP - Adv. Electron. Pack. ASME, vol. 10-2, pp. 789-794, 1995.
22. P. Li and K. T. Yang, Mechanisms for Heat Transfer Enhancement in Zero-Mean Oscillatory Flows in Short Channels. Int. J. Heat Mass Transfer, vol. 43, pp. 3351-3566, 2000.
23. A. K. Chaniotis, D. Poulikakos, and Y. Ventikos, Dual Pulsating or Steady Slot Jet Cooling of a Constant Heat Flux Surface, J. Heat Transfer, vol. 125, pp. 575-586, 2003.
24. C. Sert and A. Beskok, Numerical Simulation of Reciprocating Flow Forced Convection in Two-Dimensional Channels, J. Heat Transfer, vol. 125, pp. 403-412, 2003.
25. J. S. Go, Feasibility of Heat Transfer Enhancement in Laminar Flow Using Flow Induced Vibration of a Microfin Array, Sensors Actuators A Phys., vol. 90, pp. 232-239, 2001.
26. J. S. Go, Design of a Microfilm Array Heat Sink Using Flow-Induced Vibrations to Enhance the Heat Transfer in the Laminar Flow Regime, Sensors Actuators A Phys., vol. 105, pp. 201-210, 2003.
27. W.-S. Fu and B.-H. Tong, Numerical Investigation of Heat Transfer from a Heated Oscillating Cylinder in Cross-Flow, Int. J. Heat Mass Transfer, vol. 45, pp. 3033-3043, 2002.
28. Y. Haneda, Y. Tsuchiya, and K. Nakabe, Enhancement of Impinging Jet Heat Transfer by Making Use of Mechano-Fluid Interactive Flow Oscillation, Int. J. Heat Fluid Flow, vol. 19, pp. 115-124, 1998.
29. W.-S. Fu and K.-N. Wang, An Investigation of a Block Moving Back and Forth on a Heat Plate Under a Slot Jet. Part II (The Effects of Block Moving Distance and Vacant Distance), Int. J. Heat Mass Transfer, vol. 44, pp. 4649-4665, 2001.
30. W.-S. Fu and S.-J. Yang, Heat Transfer Induced by a Body Moving in Opposition to a Flowing Fluid, Int. J. Heat Mass Transfer, vol. 44, pp. 89-98, 2001.
31. S.-J. Yang, A Numerical Investigation of Heat Transfer Enhancement for Electronic Devices Using an Oscillating Vortex Generator, Numer. Heat Transfer A, vol. 42, pp. 269-284, 2002.
32. A.-R. A. Khaled and K. Vafai, Non-isothermal Characterization of Thin Film Oscillating Bearings, Numer. Heat Transfer A, vol. 41, pp. 451-467, 2002.
33. A.-R. A. Khaled and K. Vafai, Analysis of Flow and Heat Transfer Inside Oscillatory Squeezed Thin Films Subject to a Varying Clearance, Int. J. Heat Mass Transfer, vol. 146, pp. 631-641, 2003.
34. L. A. Florio, Static and Dynamic Methods of Enhancing Pure Natural Convection Cooling of Electronics, Ph.D. thesis, New Jersey Institute of Technology, Newark, NJ, 2005.
35. A. Harnoy, Squeeze Film Flow of Elastic Fluid at Steady State Motion and Dynamic Loads, J. Tribol. Trans. ASME, vol. 109, pp. 691-695, 1987.
36. D. J. Radakovic and M. M. Khonsari, Heat Transfer in a Thin Film Flow in the Presence of a Squeeze and Shear Thinning: Application to Piston Rings, J. Heat Trasnfer, vol. 119, pp. 249-257, 1997.
37. S. Patankar, Numerical Heat Transfer and Fluid Flow, pp. 25-153, Hemisphere, New York, 1980.