Heat transfer enhancement at solid-liquid and solid-gas interfaces by near-surface coolant agitation

IEEE Transactions on Components and Packaging Technologies

Volumn 23, Issue 3, 2000, Pages 548-554

  Kruusing, Arvi ^a   Thelemann, Torsten ^b   Thust, Heiko ^b   Leppävuori, Seppo ^a   Drüe, Karl Heinz ^b  

^a UNIVERSITY OF OULU   (Finland)

^b ILMENAU UNIVERSITY OF TECHNOLOGY   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

CERAMIC MATERIALS; COMPUTER SIMULATION; COOLANTS; COOLING; GLASS; HEAT TRANSFER COEFFICIENTS; INTERFACES (MATERIALS); MATHEMATICAL MODELS; THERMOANALYSIS; THERMOGRAPHY (TEMPERATURE MEASUREMENT);

LOW TEMPERATURE COFIRED CERAMICS (LTCC);

ELECTRONICS PACKAGING;

EID: 0034272328     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/6144.868857     Document Type: Article

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