The role of binder content on microstructure and properties of a Cu-base active brazing filler metal for diamond and cBN

Advanced Engineering Materials

Volumn 7, Issue 5, 2005, Pages 375-380

  Elsener, Hans Rudolf ^a   Klotz, Ulrich E ^a   Khalid, Fazal Ahmad ^b   Piazza, Daniele ^a   Kiser, Manfred ^a  

^a SWISS FEDERAL LABORATORIES FOR MATERIALS SCIENCE AND TECHNOLOGY   (Switzerland)

^b THE UNIVERSITY OF AGRICULTURE   (Pakistan)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; BRAZING; CERAMIC MATERIALS; ENERGY DISPERSIVE SPECTROSCOPY; FILLER METALS; MICROSTRUCTURE; MORPHOLOGY; NITRATION; PROTEINS; SCANNING ELECTRON MICROSCOPY; SURFACE STRUCTURE; TRANSMISSION ELECTRON MICROSCOPY; X RAY DIFFRACTION ANALYSIS;

BINDER CONTENT; BRAZING FILLERS; EROSION RESISTANCE; METAL PROPERTIES;

BINDERS;

EID: 20444435105     PISSN: 14381656     EISSN: None     Source Type: Journal    
DOI: 10.1002/adem.200500042     Document Type: Article

References (21)

1. M. Jennings. IDR 1990, 50, 143.
2. C.-M. Sung. Diamond Related Mat. 1999, 8, 1540.
3. C. Y. Wang, R. Clausen. Int. J. Machine Tools Manufact. 2002, 42, 1045.
4. G. Burkhard, B. Zigerlig, M. Boretius. IDR 2002, 36, 96.
5. G. Burkhard, B. Zigerlig, M. Boretius, EP Patent 1 208 945, 2002.
6. F. A. Khalid, U. E. Klotz, H. R. Elsener, B. Zigerlig, P. Gasser. Scripta Mater. 2004, 50, 1139.
7. U. E. Klotz, F. A. Khalid, H. R. Elsener, B. Zigerlig, P. Gasser. Löt 2004, 7th Int. Conf. on Brazing, High Temperature Brazing and Diffusion Bonding, DVS - German Welding Society, 2004, 231, 31.
8. R. K. Shiue, S. K. Wu, J. M. O, J. Y. Wang. Metall. Mater. Trans. A 2000, 31A, 2527.
9. W.-C. Li, C. Liang, S.-T. Lin. Metall. Mater. Trans. A 2002, 33A, 2163.
10. W.-C. Li, C. Liang, S.-T. Lin. Diamond Related Mat. 2002, 11, 1366.
11. Z. Lin, R. A. Queeny. Modern development in Powder Metallurgy, Vol. 20, Metal Powder Industry Federation, 1988, 443.
12. E. D. Kizikov, I. A. Lavrinenko. Metal Science and Heat Treatment 1975, 17, 61.
13. R. K. Shiue, S. T. Buljan, T. W. Eagar. Sci. Technol. Welding Joining 1997, 2, 71.
14. E. D. Kizikov, V. P. Kebko. Metal Science and Heat Treatment 1987, 29, 68.
15. M.-R. Huang, X.-G. Li. J. Appl. Polym. Sci. 1998, 68, 293.
16. M. Naka, J. C. Schuster, I. Nakade, S. Urai. J. Phase Equilibria 2001, 22, 352.
17. M. Naka, T. Shibayanagi, M. Maeda, J. C. Schuster, S. Urai. Löt 2001, 6th Int. Conf. on Brazing, High Temperature Brazing and Diffusion Bonding, DVS - German Welding Society, 2001, 212, 170.
18. S.Hamar-Thibault, C. H. Allibert, W. Tillmann.EUROPM 99, 1999, 57.
19. P. d. JCPDS-ICDD, release 2003.
20. P. Gasser, U. E. Klotz, F. A. Khalid, O. Beffort. Microscopy Microanal. 2004, 10, 311.
21. U. E. Klotz, C. Solenthaler. in: Science, Technology and Education of Microscopy: an Overview, Vol. 1. Bajadoz: Formatex; 2003. p. 200.