Plasma thinned SOI bonded wafers

Proceedings - IEEE International SOI Conference

Volumn , Issue , 1992, Pages 152-153

  Mumola, P B ^a   Gardopee, G J ^a   Clapis, P J ^a   Zarowin, C B ^a   Bollinger, L D ^a   Ledger, A M ^a  

^a RAYTHEON COMPANY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

FILM THICKNESS; SILICON ON INSULATOR TECHNOLOGY;

BONDED WAFERS; HIGH SPEED; SILICON FILMS;

SILICON WAFERS;

EID: 2042430853     PISSN: 1078621X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/SOI.1992.664836     Document Type: Conference Paper

References (1)

1. L. David Bollinger, et al., SPIE Advances in Fabrication and Metrology for Optics and Large Optics, vol. 966, pp. 82-107, (1988)