BaTiO3 films by low-temperature hydrothermal techniques for next generation packaging applications

Journal of Electroceramics

Volumn 13, Issue 1-3, 2004, Pages 95-100

  Balaraman, D ^a   Raj, P M ^a   Wan, L ^a   Abothu, I R ^a   Bhattacharya, S ^a   Dalmia, S ^a   Lance, M J ^a,b   Swaminathan, M ^a   Sacks, M D ^a   Tummala, R R ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

^b OAK RIDGE NATIONAL LABORATORY   (United States)

Author keywords

Barium titanate; Decoupling; Dielectric constant; Embedded capacitors; FTIR; High frequency; PWB; Raman

Indexed keywords

BARIUM TITANATE; CAPACITANCE; ELECTRONICS PACKAGING; FOURIER TRANSFORM INFRARED SPECTROSCOPY; HYDROTHERMAL SYNTHESIS; LOW TEMPERATURE OPERATIONS; PERMITTIVITY; RAMAN SPECTROSCOPY; X RAY DIFFRACTION ANALYSIS;

DECOUPLING; EMBEDDED CAPACITORS; HIGH FREQUENCY; PRINTED WIRING BOARDS (PWB);

FERROELECTRIC THIN FILMS;

EID: 20144387492     PISSN: 13853449     EISSN: None     Source Type: Journal    
DOI: 10.1007/s10832-004-5082-2     Document Type: Conference Paper

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