Wire-bonds failures Induced by resonant vibrations in the CDF silicon detector

IEEE Nuclear Science Symposium Conference Record

Volumn 3, Issue , 2003, Pages 1641-1645

  Bolla, G ^a,b   Atac, M ^b   Pavlicek, V ^b   Cancelo, G ^b   Nahn, S ^c   Mumford, R ^d   Garcia Sciveres, M ^e   Nguyen, T ^b   Forrester, S ^f   Hill, C ^g   Olszewski, J ^a,b   Rahaman, A ^h   Goldstein, J ⁱ   Ashmanskas, B ^j   Maruyama, T ^k   Lu, R S ^l   Spalding, J ^b   Tang, Z ^b   Zimmerman, T ^b   Moccia, S ^b   Lewis, J D ^b   more..

^a PURDUE UNIVERSITY   (United States)

^b FERMI NATIONAL ACCELERATOR LABORATORY   (United States)

^c YALE UNIVERSITY   (United States)

^d JOHNS HOPKINS UNIVERSITY   (United States)

^e LAWRENCE BERKELEY NATIONAL LABORATORY   (United States)

^f UNIVERSITY OF CALIFORNIA   (United States)

^g UNIVERSITY OF CALIFORNIA   (United States)

^h UNIVERSITY OF PITTSBURGH   (United States)

ⁱ RUTHERFORD APPLETON LABORATORY   (United Kingdom)

^j ARGONNE NATIONAL LABORATORY   (United States)

^k UNIVERSITY OF CHICAGO   (United States)

^l ACADEMIA SINICA   (Taiwan)

more..

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; FAILURE ANALYSIS; INSTALLATION; MAGNETIC FIELDS; OSCILLATIONS; RESONANCE; STRESS ANALYSIS; VIBRATIONS (MECHANICAL);

FAILURE MODES; MODULES; TRIGGER CONDITIONS; WIRE BONDS;

SILICON SENSORS;

EID: 19944428580     PISSN: 10957863     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/nssmic.2003.1352193     Document Type: Conference Paper

References (10)

1. J. Antos et al., "The SVXII silicon vertex detector upgrade at CDF". Nucl. Instrum. Meth. A383:13-20, 1996.
2. G. Bolla 'Testing and quality insurance during the construction of the SVXII silicon detector". Nucl. Instrum. Meth., vol. A473, pp. 53-60, 2001.
3. M. Garcia-Sciveres et al., "Readout electronics architecture and packaging for the CDF silicon upgrade". Nucl. Instrum. Meth., vol. A392, pp. 375-379, 1997.
4. Y. Gotra et al., "The port card for the silicon vertex detector upgrade of the collider detector at Fermilab". IEEE Trans. Nucl. Sci., vol. 48, pp. 504-508, 2001.
5. S. Hou, "Experience with the parallel optical link for the CDF silicon detector", Nucl. Instrum. Meth., vol. A511, pp. 166-170, 2003.
6. M. Garcia-Sciveres, et al., "The SVX3d integrated circuit for deadtimeless silicon strip readout", Nucl. Instrum. Meth., vol. A435, pp 166-170, 1999.
7. T. Zimmerman et al., "SVX3: a dead-timeless readout chip for silicon strip detectors", Nucl. Instrum. Meth., vol. A409, pp 369-374, 1998.
8. More details about the FEA analysis can be found at the following URL: www-cdf.fnal.gov/upgrades/silicon/TASK-Force/FEA.html.
9. More details about the Magnet used for these tests can be found at the following URL:http://www-cdf.final.gov/upgrades/TOF/doc/notes/cdf-2573/node36.html.
10. T. Raymond et al. "Brittle cracks induced in AlSi wire by the ultrasonic bonding tool vibrations", IEEE Transaction on Component, Hybrids and Manufacturing Technology, vol. 14, no. 4, December 1991.