Readout electronics architecture and packaging for the CDF silicon upgrade

Nuclear Instruments and Methods in Physics Research, Section A: Accelerators, Spectrometers, Detectors and Associated Equipment

Volumn 392, Issue 1-3, 1997, Pages 375-379

  Garcia Sciveres, Maurice ^a  

^a LAWRENCE BERKELEY NATIONAL LABORATORY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS ENGINEERING; ELECTRONICS PACKAGING; PERFORMANCE; RADIATION DETECTORS; READOUT SYSTEMS;

VERTEX DETECTORS;

SEMICONDUCTOR COUNTERS;

EID: 0031168566     PISSN: 01689002     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0168-9002(97)00248-9     Document Type: Article

References (12)

1. The average live time was approximately 80%.
2. F. Abe et al., Phys. Rev. Lett. 74 (1995) 2626.
3. M. Paulini, Highlights of B Physics at CDF, Proc. Fermilab-Conf-95-253-E (1995); Nuovo Cimiento, Proc. 6th Int. Symp. on Heavy Flavor Physics, Pisa, Italy, June 1996, to appear.
4. M. Paulini, Highlights of B Physics at CDF, Proc. Fermilab-Conf-95-253-E (1995); Nuovo Cimiento, Proc. 6th Int. Symp. on Heavy Flavor Physics, Pisa, Italy, June 1996, to appear.
5. D. Amiedei et al., Nucl. Instr. and Meth. A 350 (1994) 73.
6. S. Cihangir et al., Nucl. Instr. and Meth. A 360 (1995) 137.
7. D. Amiedei et al., Nucl. Instr. and Meth. A 269 (1988) 51.
8. -3.
9. The description of digitization has been simplified for clarity. Details of how voltages are presented to the comparator and of how the RA output is compensated using the 47th pipeline capacitor have been left out.
10. Two bytes are used to read out each channel, one for channel number and the other for ADC counts.
11. Based on a finite element model that takes into account heat generated in the silicon sensors by a temperature-dependent leakage current. Thermal runaway does not occur in the model until the maximum sensor temperature approaches 25°C.
12. Micro-machining is a term commonly used to encompass a host of methods for chemical milling of silicon, making use of processing capabilities of the integrated circuit industry.