Template assisted fabrication of tin nanospheres by thermal expansion and rapid solidification process

Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers

Volumn 44, Issue 3, 2005, Pages 1524-1528

  Chen, Chien Chon ^a   Kuo, Chin Guo ^a   Chao, Chuen Guang ^a  

^a NATIONAL CHIAO TUNG UNIVERSITY   (Taiwan)

Author keywords

Nanospheres; Rapid solidification; Sn; Surface tension; Thermal expansion

Indexed keywords

ALUMINA; ELECTRIC CONDUCTIVITY; MELTING; RAPID SOLIDIFICATION; SURFACE ROUGHNESS; SURFACE TENSION; THERMAL EXPANSION; TIN;

ANODIC ALUMINUM OXIDE (AAO); GAS ATOMIZATION (GA); MELTING TEMPERATURE; NANOSPHERES;

NANOSTRUCTURED MATERIALS;

EID: 19944406501     PISSN: 00214922     EISSN: None     Source Type: Journal    
DOI: 10.1143/JJAP.44.1524     Document Type: Article

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