Effects of current density on adhesion of copper electrodeposits to polyimide substrates

Journal of Applied Electrochemistry

Volumn 28, Issue 9, 1998, Pages 971-977

  Prentice, G A ^a   Chen, K S ^b  

^a UNIVERSITY OF DETROIT MERCY   (United States)

^b SANDIA NATIONAL LABORATORIES   (United States)

Author keywords

Adhesion; Copper; Current density; Plastic; Plating; Polyimide

Indexed keywords

ADHESION; COPPER PLATING; CURRENT DENSITY; POLYIMIDES;

PLASTIC SUBSTRATES;

ELECTRODEPOSITION;

EID: 0032154928     PISSN: 0021891X     EISSN: None     Source Type: Journal    
DOI: 10.1023/A:1003437616899     Document Type: Article

References (12)

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