Thermal optimization of microchannel heat sink with pin fin structures

American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP

Volumn 3, Issue , 2003, Pages 593-602

  Kim, Duckjong ^a   Kim, Sung Jin ^b  

^a Korea Institute of Machine and Materials   (South Korea)

^b Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

Author keywords

Compact modeling; Heat sinks; Microstructures; Pin fin shape; Porous medium approach

Indexed keywords

ASPECT RATIO; DENSITY (SPECIFIC GRAVITY); HEAT TRANSFER; MICROSTRUCTURE; NUSSELT NUMBER; POROSITY; POROUS MATERIALS; PRESSURE DROP;

MICROCHANNELS; THERMAL OPTIMIZATION;

FINS (HEAT EXCHANGE);

EID: 1942536162     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/IMECE2003-42180     Document Type: Conference Paper

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