Frequency optimization for capacitively coupled plasma source

IEEE Transactions on Plasma Science

Volumn 33, Issue 2 I, 2005, Pages 382-383

  Bera, Kallol ^a   Hoffman, Daniel ^a   Shannon, Steve ^a   Delgadino, Gerardo ^a   Ye, Yan ^a  

^a APPLIED MATERIALS INC   (United States)

Author keywords

All in one process; Capacitively coupled discharge; Corner protection; Dual damascene; Ion energy; Plasma density; Plasma production efficiency; Trench etch; Very high frequency

Indexed keywords

CARRIER CONCENTRATION; FREQUENCIES; GLOW DISCHARGES; ION BOMBARDMENT; OPTIMIZATION; PLASMA DENSITY;

CAPACITIVELY COUPLED DISCHARGES; CAPACITIVELY COUPLED PLASMA; CORNER PROTECTION; DUAL DAMASCENE; FREQUENCY OPTIMIZATION; ION ENERGY; PLASMA PRODUCTION EFFICIENCY; TRENCH ETCH; VERY HIGH FREQUENCY;

PLASMA SOURCES;

EID: 18844392837     PISSN: 00933813     EISSN: None     Source Type: Journal    
DOI: 10.1109/TPS.2005.845934     Document Type: Article

References (3)

1. M. J. Kushner, "Modeling of magnetically enhanced capacitively coupled plasma sources: Ar discharges," J. Appl. Phys., vol. 94, pp. 1436-1447, 2003.
2. M. Surendra and D. B. Graves, "Capacitively coupled glow discharges at frequencies above 13.56 MHz," Appl. Phys. Lett., vol. 59, pp. 2091-2093, 1991.
3. M. Moisan, C. Barbeau, R. Claude, C. M. Ferreira, J. Margot, J. Paraszczak, A. B. Sa, G. Sauve, and M. R. Wertheimer, "Radio frequency or microwave plasma reactors? Factors determining the optimum frequency of operation," J. Vac. Science Tech. B, vol. 9, pp. 8-25, 1991.