X-ray diffraction residual stress measurement reliability: Stressed reference samples

Materials Science Forum

Volumn 404-407, Issue , 2002, Pages 573-578

  Ferreira, C ^a   Francois M ^a   Guillen R ^a  

^a CRTT   (France)

Author keywords

Residual Stress; Statistics; Stressed Standards Samples; X Ray Diffraction

Indexed keywords

DEFECTS; ERROR ANALYSIS; POLYCRYSTALLINE MATERIALS; STANDARDIZATION; STATISTICAL METHODS; X RAY DIFFRACTION ANALYSIS;

GEOMETRICAL ERRORS;

RESIDUAL STRESSES;

EID: 18744432578     PISSN: 02555476     EISSN: 16629752     Source Type: Book Series    
DOI: 10.4028/www.scientific.net/msf.404-407.573     Document Type: Conference Paper

References (6)

1. I.C. Noyan & J.B. Cohen, "Residual Stress: Measurement by Diffraction and Interpretation", Springer (1987), New York.
2. M. François & B. Bourniquel, "Parameters Influencing Peak Localisation Repeatability for X-ray Measurements, Zeitschrift für Metallkunde 5/2000, pp. 414-421.
3. F. Convert and B. Miege, "The Control of Geometrical Sources of Error in X-ray Diffraction Applied to Stress Analysis", J. Appl. Cryst, 25, (1992), pp. 384-390.
4. M. François & R. Botzon "Towards Reference Samples for X-ray Stress Analysis", ECRS-6 (1999).
5. "Essais non destructifs: Méthodes d'essais pour l'analyse des contraintes résiduelles par diffraction des rayons X", Norme XPA 09-285, indice de classement A 09-285, (mai 1999).
6. ISO 5725, "Application of statistics, accuracy of BCR reference materials", Measurements and testing Programme, European Commission, (1997).