Analysis and design of MEMS and embedded components in silicon/LTCC packages using FDTD/MRTD for system-on-package applications (SOP)

2003 Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems - Digest of Papers

Volumn , Issue , 2003, Pages 138-141

  Tentzeris, M ^a   Bushyager, N ^a   Laskar, J ^a   Zheng, G ^a   Papapolymerou, J ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

Adaptive arrays; Broadband antennas; Electronics packaging; Finite difference methods; Frequency; Micromechanical devices; Silicon; Time domain analysis; Transceivers; Transmission line antennas

Indexed keywords

ANTENNAS; ELECTRONICS PACKAGING; FINITE DIFFERENCE METHOD; FREQUENCY DOMAIN ANALYSIS; INTEGRATED CIRCUITS; MONOLITHIC INTEGRATED CIRCUITS; RADIO TRANSCEIVERS; SILICON; SMART ANTENNAS; SYSTEM-ON-PACKAGE; TRANSCEIVERS; TRANSMISSION LINE THEORY;

ADAPTIVE ARRAYS; BROAD-BAND ANTENNA; FREQUENCY; MICROMECHANICAL DEVICE; TRANSMISSION LINE ANTENNA;

TIME DOMAIN ANALYSIS;

EID: 18744382645     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/SMIC.2003.1196689     Document Type: Conference Paper

References (6)

1. K.Lim et al., "RF-System-On-Package (SOP) for Wireless Communications", IEEE Microwave Magazine, Vol.3, No.1, pp.88-99, March 2002.
2. A. Taflove and S. Hagness, Computational Electrodynamics: The Finite Difference Time Domain Method, 2nd Ed., Norwood, MA. Artech House, 2000.
3. N. Bushyager, B.McGarvey and E.M.Tentzeris, "Adaptive numerical modeling of RF structures requiring the coupling of Maxwell's, mechanical, and solid-state equations," Proc. 17th Annual Review of Progress in Applied Computational Electromagnetics, pp.1-8, Monterey, CA, March 2001.
4. G. E. Ponchak, E.Dalton, E.M.Tentzeris and J.Papapolymerou, "Coupling Between Microstrip Lines with Finite Width Ground Plane Embedded in Polyimide Layers", Proc. 2002 IEEE International Microwave Symposium, pp.III.2221-2224, Seattle, WA, June 2002.
5. N.Bushyager and E.M.Tentzeris, "Modeling and Design of RF MEMS Structures Using Computationally Efficient Numerical Techniques", Invited Paper in the 2001 IEEE Electronic Components and Technology Conference, pp.324-327, Lake Buena Vista, FL, May 2001.
6. E. Tentzeris, R. L. Li, K. Lim, M. Maeng, E. Tsai, G. DeJean, and J. Laskar, "Design of Compact Stacked-Patch Antennas on LTCC Technology for Wireless Communication Applications", Proc.2002 IEEE Antennas and Propagation Symposium, pp.II.500-503, San Antonio, TX, June 2002.