Influence of Grain Size on the Tensile Creep Behavior of Ytterbium-Containing Silicon Nitride

Journal of the American Ceramic Society

Volumn 87, Issue 3, 2004, Pages 421-430

  Wiederhorn, Sheldon M ^a,b   De Arellano Lopez, Antonio R ^a,c   Luecke, William E ^a,b   Hoffmann, Michael J ^a,d   Hockey, Bernard J ^a   French, Jonathan D ^a   Yoon, Kyung Jin ^a,e  

^a NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY   (United States)

^b AMERICAN CERAMIC SOCIETY   (United States)

^c UNIVERSITY OF SEVILLE   (Spain)

^d UNIVERSITY OF KARLSRUHE   (Germany)

^e Korea Research Institute of Standards and Science   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ACTIVATION ENERGY; ALUMINUM COMPOUNDS; ANNEALING; CREEP; GRAIN SIZE AND SHAPE; PRECIPITATION (CHEMICAL); THIN FILMS; X RAY SPECTROMETERS; YTTERBIUM;

CREEP RATE; DISLOCATION MOTION; SLIDING INTERFACES;

SILICON NITRIDE;

EID: 1842855298     PISSN: 00027820     EISSN: None     Source Type: Journal    
DOI: 10.1111/j.1551-2916.2004.00421.x     Document Type: Article

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