Creep processes in the advanced silicon nitride ceramics

Key Engineering Materials

Volumn 171-174, Issue , 2000, Pages 747-754

  Lofaj, F ^a,c   Okada, A ^b   Ikeda, Y ^b   Kawamoto, H ^b  

^a INSTITUTE OF MATERIALS RESEARCH   (Slovakia)

^b JAPAN FINE CERAMICS CENTER   (Japan)

^c NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CAVITATION; CREEP; CREEP TESTING; DUCTILITY; GRAIN BOUNDARIES; HIGH TEMPERATURE TESTING; OXIDATION; PHASE TRANSITIONS; STRAIN MEASUREMENT; STRAIN RATE; TENSILE STRESS;

CREEP RESISTANCE; FAILURE STRAINS; GAS PRESSURE SINTERED; GRAIN BOUNDARY SLIDING; LUECKE AND WIEDERHORN MODEL; MULTIGRAIN JUNCTION CAVITIES; QUASI DUCTILE BEHAVIOR; TENSILE CREEP;

SILICON NITRIDE;

EID: 4244212498     PISSN: 10139826     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

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