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Journal of the American Ceramic Society

Volumn 87, Issue 3, 2004, Pages 490-492

Crack Healing in Silicon Carbide

(5) Chu, Min Cheol a Cho, Seong Jai a,c Lee, Yun Chul a,b Park, Hyun Min a,b Yoon, Duk Y a,b

a Korea Research Institute of Standards and Science (South Korea)

b Korea Advanced Institute of Science and Technology (KAIST) (South Korea)

c AMERICAN CERAMIC SOCIETY (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINA; COMPRESSIVE STRENGTH; CRACKS; MICROSTRUCTURE; OXIDATION; RESIDUAL STRESSES; SCANNING ELECTRON MICROSCOPY; THERMAL EXPANSION; TRANSMISSION ELECTRON MICROSCOPY; VICKERS HARDNESS TESTING;

CRACK HEALING; FRACTOGRAPHIC ANALYSIS;

SILICON NITRIDE;

EID: 1842686767 PISSN: 00027820 EISSN: None Source Type: Journal
DOI: 10.1111/j.1551-2916.2004.00490.x Document Type: Article

Times cited : (31)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.