Forced convective boiling in microchannels for KW/cm2 Electronics cooling

Proceedings of the ASME Summer Heat Transfer Conference

Volumn 2003, Issue , 2003, Pages 329-336

  Faulkner, Daniel J ^a   Shekarriz, Reza ^a  

^a MicroEnergy Technologies Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COALESCENCE; COOLING SYSTEMS; FINS (HEAT EXCHANGE); HEAT FLUX; HEAT LOSSES; NANOSTRUCTURED MATERIALS; NUCLEATE BOILING; OPTIMIZATION; SEMICONDUCTOR DEVICES; VISCOSITY OF LIQUIDS;

ELECTRONICS COOLING; MICROCHANNELS;

FORCED CONVECTION;

EID: 1842627767     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/ht2003-47160     Document Type: Conference Paper

References (17)

1. Faulkner, D., M. Khotan, and R. Shekarriz, 2003, "Managing Electronics Thermal Management." Invited editorial article to be published in Int. J. Heat Transfer Eng., Editor in Chief: Dr. A. Ghajar.
2. Mudawar, I, "Assessment of High-Heat Flux Thermal Management Schemes," IEEE Transactions on Components and Packaging Technologies, 24, No. 2, pp 122-141, 2001.
3. Kays, W.M. and A.L. London, Compact Heat Exchangers, 2nd Edition, McGraw-Hill Book Company, New York.
4. Shekarriz, R. and C.J. Call. "State-of-the-Art in Micro- and Meso-Scale Heat Exchangers," Presented at the ASME-IMECE, Nashville, TN, Nov. 14-19, 1999.
5. Shekarriz, A., "Challenges in Thermal Systems Miniaturization," Journal of Heat Transfer Engineering, 21, No.6, pp. 1-2, 2000.
6. Campbell, G.O., "Micro-channel Cooling Using LIGA Fabrication Methods," ASME IMECE, Workshop on New Frontiers in Compact Heat Exchanger Technology, 1998.
7. Ravigururajan, T.S. and M.K. Drost, "Liquid Flow Characteristics in a Diamond-Pattern Micro-Heat-Exchanger," DSC-Vol.59, ASME Int. Mech. Eng. Congress and Exhibition, Atlanta, GA, Nov. 17-22, 1996.
8. Cuta, J.M., C.E. McDonald, and A. Shekarriz, "Forced Convection Heat Transfer in Parallel Channel Array Microchannel Heat Exchangers," PID-Vol.2/HTD-Vol. 338: Advances in Energy Efficiency, ASME Int. Mech. Eng. Congress and Exhibition, Atlanta, GA, Nov. 17-22, 1996.
9. Pfund, D., A. Shekarriz, A. Popescu, and J.R. Welty, 1998, "Pressure Drop and Transition in Micro-channels," Proceeding of the ASME Int. Mech. Eng. Congress and Exhibition, November 18-23, 1998, Anaheim, CA.
10. Bowers, M.B. and I. Mudawar, "Two-Phase Electronic Cooling Using Mini-Channel and Micro-Channel Heat Sinks: Part 1 - Design Criteria and Heat Diffusion Constraints," ASME J. Electronic Packaging, pp. 290-297, 1994.
11. Bowers, M.B. and I. Mudawar, "Two-Phase Electronic Cooling Using Mini-Channel and Micro-Channel Heat Sinks:Part 2 - Flow Rate and Pressure Drop Constraints," ASME J. Electronic Packaging, pp. 298-305, 1994.
12. Tong, L.S. and Y.S. Tang, Boiling Heat Transfer and Two-Phase Flow, Taylor & Francis, 2nd Ed., Washington, D.C, 1997.
13. Kays, W. M., Convective Heat and Mass Transfer, McGraw-Hill Book Company, New York, 1966.
14. Sparrow, E. M., and Siegel, R., Int. Journal Heat and Mass Transfer, 1, #161.
15. Chen, J.S., 1963, "A Correlation for Boiling Heat Transfer to Saturated Fluids in Convective Flow," ASME Paper 63-HT-106.
16. Incropera, F.P. and D.P. DeWitt, ., 1990. Fundamentals of Heat and Mass Transfer. John Wiley & Sons, New York, pp. 494-495.
17. Giridharan, M.G., J.C. Sheu, S.H. Hong, R. Shekarriz, and C. Call, 1999, "Computational and Experimental Analyses of a Meso-Scale Heat Exchanger," Presented at the 1999 ASME-IMECE, Nashville, TN, Nov. 14-19.