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Volumn 1999-Q, Issue , 1999, Pages 99-108

COMPUTATIONAL AND EXPERIMENTAL ANALYSIS OF A MESO-SCALE HEAT EXCHANGER

Author keywords

[No Author keywords available]

Indexed keywords

BOUNDARY LAYERS; COMPUTATIONAL FLUID DYNAMICS; HEAT RESISTANCE; HOT AIR HEATING; TOXIC MATERIALS;

EID: 0342834625     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/imece1999-1067     Document Type: Conference Paper
Times cited : (3)

References (19)
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    • Bejan, A., and Morega, A. M., 1993, “Optimal Arrays of Pin Fins and Plate Fins in Laminar Forced Convection,” ASME Journal ofHeat Transfer, Vol. 115, pp. 75-81.
    • (1993) ASME Journal ofHeat Transfer , vol.115 , pp. 75-81
    • Bejan, A.1    Morega, A. M.2
  • 2
    • 0026982349 scopus 로고
    • Simulation of Slip-Flows in Complex Micro-Geometries
    • Beskok, A., and Kamiadakis, G. E., 1992, “Simulation of Slip-Flows in Complex Micro-Geometries,” ASME DSC-Vol. 40, pp. 355-370.
    • (1992) ASME DSC , vol.40 , pp. 355-370
    • Beskok, A.1    Kamiadakis, G. E.2
  • 3
    • 0003734630 scopus 로고    scopus 로고
    • Version 5
    • CFD Research Corporation, 1998, “CFD-ACE Theory Manual,” Version 5.
    • (1998) CFD-ACE Theory Manual
  • 4
    • 0026993878 scopus 로고
    • High Performance Microchannel Heat Exchanger for Cooling High Heat Load X-ray Optical Elements
    • Choi, U. S., Rogers, C. S., and Mills, D. S. M., 1992, “High Performance Microchannel Heat Exchanger for Cooling High Heat Load X-ray Optical Elements,” ASME DSC-VOl. 40, pp. 83-89.
    • (1992) ASME DSC-VOl , vol.40 , pp. 83-89
    • Choi, U. S.1    Rogers, C. S.2    Mills, D. S. M.3
  • 5
    • 77951907872 scopus 로고
    • Review of Microscale Heat Transfer
    • Duncan, A. B., and Peterson, G. P., 1994, “Review of Microscale Heat Transfer,” Appl. Meeh. Rev., Vol. 47, pp. 397-428.
    • (1994) Appl. Meeh. Rev , vol.47 , pp. 397-428
    • Duncan, A. B.1    Peterson, G. P.2
  • 7
    • 0021482576 scopus 로고
    • Heat Transfer in Forced Convection through Fins
    • Keyes, R. W., 1984, “Heat Transfer in Forced Convection through Fins,” IEEE Trans on Electron Devices, Vol. ED-31, pp. 1218-1231.
    • (1984) IEEE Trans on Electron Devices , vol.ED-31 , pp. 1218-1231
    • Keyes, R. W.1
  • 8
    • 0343140524 scopus 로고
    • Thermal Stress in the Microchannel Heat Sink Cooled by Liquid Nitrogen
    • Lawrence Livermore National Laboratoiy, Paper No. UCRL-JC-114422
    • Riddle, R. A., 1993, “Thermal Stress in the Microchannel Heat Sink Cooled by Liquid Nitrogen,” Lawrence Livermore National Laboratoiy, Paper No. UCRL-JC-114422.
    • (1993)
    • Riddle, R. A.1
  • 13
    • 51249172090 scopus 로고
    • Convective Heat Transfer in Microchannels
    • Samalam, V. K., 1989, “Convective Heat Transfer in Microchannels,” J. Electronic Materials, Vol. 18, pp. 611-617.
    • (1989) J. Electronic Materials , vol.18 , pp. 611-617
    • Samalam, V. K.1
  • 15
    • 0019563707 scopus 로고
    • High-Performance Heat Sinking for VLSI
    • Tuckerman, D., and Pease, R., 1981, “High-Performance Heat Sinking for VLSI,” IEEE Electron Device Letters, EDL-2(5), pp. 126-129.
    • (1981) IEEE Electron Device Letters , vol.EDL-2 , Issue.5 , pp. 126-129
    • Tuckerman, D.1    Pease, R.2
  • 16
    • 0026378058 scopus 로고
    • Thermal-Hydraulic Characteristics of Micro Heat Exchangers
    • Wang, J. H., Yeh, H. Y., and Shyu, K J., 1991, “Thermal-Hydraulic Characteristics of Micro Heat Exchangers,” ASME DSC-Vol. 32, pp. 331-339.
    • (1991) ASME DSC , vol.32 , pp. 331-339
    • Wang, J. H.1    Yeh, H. Y.2    Shyu, K J.3
  • 18
  • 19
    • 0031098953 scopus 로고    scopus 로고
    • Micro Heat Exchangers Consisting of Pin Arrays
    • Yin, X., and Bau, H. H., 1997b, “Micro Heat Exchangers Consisting of Pin Arrays,” ASME Journal of Electronic Packaging, Vol. 119, pp. 51-57.
    • (1997) ASME Journal of Electronic Packaging , vol.119 , pp. 51-57
    • Yin, X.1    Bau, H. H.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.