New ultra-precision CMP technique applying direct air-back method and non-foaming plastic pad

1999 IEEE International Symposium on Semiconductor Manufacturing, ISSM 1999 - Conference Proceedings

Volumn , Issue , 1999, Pages 225-228

  Doy, T K ^a   Sakai, K ^b   Jeong, H ^c   Ohmori, H ^d   Kasai, T ^a  

^a SAITAMA UNIVERSITY   (Japan)

^b Tokyo Seimitu CoLtd   (Japan)

^c Pusan National University   (South Korea)

^d RIKEN   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

MANUFACTURE; POLISHING; SEMICONDUCTOR DEVICE MANUFACTURE; SILICA; SILICON COMPOUNDS; SILICON OXIDES; CHEMICAL POLISHING; CHEMICAL VAPOR DEPOSITION; INTEGRATED CIRCUIT MANUFACTURE; PRESSURIZATION; SEMICONDUCTING FILMS; SEMICONDUCTING SILICON COMPOUNDS; SILICON WAFERS;

CONVENTIONAL TECHNIQUES; FOAMING PLASTICS; PLANARIZATION; POLISHING PADS; SIO2 FILM; ULTRA PRECISION; V-SHAPED GROOVES; WAFER SURFACE;

SILICON WAFERS; ULSI CIRCUITS;

CHEMICAL-MECHANICAL POLISHING (CMP); DIRECT AIR-BACK PRESSURIZATION; PLANARIZATION POLISHING;

EID: 0033328937     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISSM.1999.808777     Document Type: Conference Paper

References (7)

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