Addressing Cu contamination via spin-etch cleaning

Solid State Technology

Volumn 42, Issue 11, 1999, Pages

  Lysaght, Patrick S ^a   West, Michael ^b  

^a SEMATECH   (United States)

^b SEZ America Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER PLATING; DECONTAMINATION; ELECTROPLATING; ETCHING;

SPIN ETCH CLEANING;

SEMICONDUCTOR DEVICE MANUFACTURE;

EID: 18344414023     PISSN: 0038111X     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Article

References (4)

1. P. Lysaght et al., "A Novel Wafer Backside Spin-Process Contamination Elimination for Advanced Copper Device Applications," ECS, October 1999.
2. CRC Handbook of Metal Etchants, eds. P. Wakler, W.H. Tarn, CRC Press, 1991.
3. Handbook of Chemistry and Physics, 52d Edition, ed. R.C. Weast, 1971-1972.
4. J-C. Lin, C. Lee, "A Study on the Grain Boundary Diffusion of Copper in Tantalum Nitride Thin Films," ECS and Solid-State Letters, pp. 181 -183, April 1999.