Electrical and mechanical properties of Bi-2223/Ag/barrier/Ag composite tapes

Superconductor Science and Technology

Volumn 13, Issue 4, 2000, Pages 378-384

  Kovac P ^a   Husek I ^a   Gomory F ^a   Oduleye, O O ^b   Pachla, W ^c   Diduszko, R ^d   Alford, N McN ^b  

^a INSTITUTE OF ELECTRICAL ENGINEERING   (Slovakia)

^b LONDON SOUTH BANK UNIVERSITY   (United Kingdom)

^c INSTITUTE OF HIGH PRESSURE PHYSICS   (Poland)

^d INSTITUTE OF VACUUM TECHNOLOGY   (Poland)

Author keywords

[No Author keywords available]

Indexed keywords

BENDING (DEFORMATION); BISMUTH COMPOUNDS; COMPOSITE MATERIALS; DIFFUSION; ELASTIC MODULI; HIGH TEMPERATURE SUPERCONDUCTORS; INTERFACES (MATERIALS); OXIDE SUPERCONDUCTORS; OXYGEN; POWDERS; SILVER;

SINGLE-CORE TAPES;

SEMICONDUCTING FILMS;

EID: 18244420048     PISSN: 09532048     EISSN: None     Source Type: Journal    
DOI: 10.1088/0953-2048/13/4/308     Document Type: Article

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