|
Volumn 4, Issue 5, 2001, Pages 12-27
|
Diffusion bonding and brazing of high purity copper for linear collider accelerator structures
|
Author keywords
[No Author keywords available]
|
Indexed keywords
|
EID: 18144388279
PISSN: 10984402
EISSN: 10984402
Source Type: Journal
DOI: 10.1103/PhysRevSTAB.4.053502 Document Type: Article |
Times cited : (19)
|
References (18)
|