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Volumn 4, Issue 5, 2001, Pages 12-27

Diffusion bonding and brazing of high purity copper for linear collider accelerator structures

Author keywords

[No Author keywords available]

Indexed keywords


EID: 18144388279     PISSN: 10984402     EISSN: 10984402     Source Type: Journal    
DOI: 10.1103/PhysRevSTAB.4.053502     Document Type: Article
Times cited : (19)

References (18)
  • 7
    • 18144405902 scopus 로고    scopus 로고
    • Work performed by Vectron Corp., 1997
    • Work performed by Vectron Corp., 1997.
  • 8
    • 18144400707 scopus 로고    scopus 로고
    • private communication
    • C. Evans (private communication).
    • Evans, C.1
  • 9
  • 10
  • 17
    • 0007341265 scopus 로고
    • ASM International, Metals Park, OH, 9th ed.
    • Metals Handbook (ASM International, Metals Park, OH, 1979), 9th ed., Vol. 2, p. 277.
    • (1979) Metals Handbook , vol.2 , pp. 277


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.