Micro-metalforming with silicon dies

Microsystem Technologies

Volumn 7, Issue 4, 2001, Pages 191-195

  Bohm J ^a   Schubert, A ^a   Otto, T ^b   Burkhardt, T ^a  

^a FRAUNHOFER INSTITUTE FOR MACHINE TOOLS AND FORMING TECHNOLOGY IWU   (Germany)

^b Fraunhofer Institute Reliability and Microintegration   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 18044402561     PISSN: 09467076     EISSN: None     Source Type: Journal    
DOI: 10.1007/s005420000084     Document Type: Article

References (10)

1. Becker H; Heim U (1999) Silicon as tool material for polymer hot embossing. Proc 12th IEEE Int Conf on MEMS '99, Orlando, pp 228-231
2. Becker H; Heim U (1999) Polymer high aspect ration structures fabricated with hot embossing. Proc 10th Int Conf on Transducers '99, 7-10 June 1999, Sendai
3. Geiger M; Engel U; Vollertsen F; Kals R (1994) Metal forming of micro parts for electronics. Prod Eng 2/1: 15-18
4. Geiger M; Vollertsen F; Kais R (1996) Fundamentals on the manufacturing of sheet metal microparts. Annuals of the CIRP, Manufacturing Technology 45(1): 277-282
5. Neugebauer R; Schubert A; Burkhardt T (1997) Möglichkeiten und Vorgehensweise bei der Nutzbarmachung umformtechnischer Verfahren in der Mikrosystemtechnik. 3. Tagung Mikrosystemtechnik, 13-14 October 1997, Chemnitz
6. Neugebauer R; Schubert A; Kadner J; Burkhardt T (1999) High precision embossing of microparts. Proc 6th Int Conf ICTP, Nürnberg, pp 921-926
7. Ruprecht R (1997) Verschiedene Abformverfahren für die Herstellung von dreidimensionalen Metall-Mikrostrukturen. Swiss Plastics 19(12): 5-9
8. Saotome Y; Inoue A (1994) Superplastic micro-forming of microstructures. Proc of IEEE Int Conf of MEMS'94: An Investigations of Micro Structures, Sensors, Actuators, Machines and Robotic Syst., Oiso, pp 343-348
9. Saotome Y; Inoue A (2000) New amorphous alloys as micro-materials and the processing technologies. Proc of 13th IEEE of MEMS, Miyazaki, pp 288-292
10. Schubert A; Burkhardt T; Kadner J; Neugebauer R (1999) High precision embossing of metallic parts with microstructures. Proc 1st Int Conf and Gen Meet EUSPEN, Bremen, Proc. Vol. 1: 530-533