Modeling of ultra thin resist film structure after spin-coating and post-application bake

Microelectronic Engineering

Volumn 73-74, Issue , 2004, Pages 223-227

  Tortai, J H ^a  

^a CEA LETI   (France)

Author keywords

Modeling; Structure; Thermal properties; Thin films

Indexed keywords

COMPUTER SIMULATION; DEPOSITION; DIFFUSION; EVAPORATION; HYDRODYNAMICS; SOLVENTS; SPIN COATING;

HYDRODYNAMIC FLOW; POST-APPLICATION BAKES (PAB); RESIST FILMS; TEMPORAL EVOLUTION;

ULTRATHIN FILMS;

EID: 17344380918     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0167-9317(04)00102-9     Document Type: Conference Paper

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