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Materials Science Forum

Volumn 475-479, Issue II, 2005, Pages 993-996

Stabilization of nano-Al2O3p/Cu composite after high temperature annealing treatment

(5) Song, Kexing a,b Liu, Ping b Tian, Baohong b Dong, Qiming b Xing, Jiandong a

a XI'AN JIAOTONG UNIVERSITY (China)

b HENAN UNIVERSITY OF SCIENCE AND TECHNOLOGY (China)

Author keywords

Al2O3 particle; Composite; Electrical conductivity; Hardness

Indexed keywords

ALUMINA; ANNEALING; COLD WORKING; COPPER ALLOYS; CREEP; DEFORMATION; ELECTRIC CONDUCTIVITY; HARDNESS; HIGH TEMPERATURE OPERATIONS; MICROSTRUCTURE; RECRYSTALLIZATION (METALLURGY); STRENGTH OF MATERIALS; THERMAL CONDUCTIVITY; TRANSMISSION ELECTRON MICROSCOPY;

AL2O3 PARTICLES; CREEP STRENGTHS; DISPERSOIDS; HIGH TEMPERATURE ANNEALING TREATMENTS;

COMPOSITE MATERIALS;

EID: 17144427741 PISSN: 02555476 EISSN: 16629752 Source Type: Book Series
DOI: 10.4028/0-87849-960-1.993 Document Type: Conference Paper

Times cited : (22)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.