Tensile deformation and fracture behavior of an oxide dispersion strengthened copper alloy

Materials and Design

Volumn 21, Issue 3, 2000, Pages 191-198

  Srivatsan, T S ^a   Narendra, N ^b   Troxell, J D ^c  

^a The University of Akron   (United States)

^b Ohio State University   (United States)

^c OMG Americas   (United States)

Author keywords

Deformation; Dispersion strengthened copper; Fracture; Microstructure; Tensile properties

Indexed keywords

DEFORMATION; DISPERSION HARDENING; DUCTILITY; ELECTRIC CONDUCTIVITY OF SOLIDS; ELECTRIC RESISTANCE; FRACTURE TOUGHNESS; METALLOGRAPHIC MICROSTRUCTURE; TENSILE STRENGTH; THERMAL CONDUCTIVITY OF SOLIDS; THERMAL EFFECTS;

TENSILE DEFORMATION;

COPPER ALLOYS;

COPPER ALLOY; DEFORMATION; FRACTURE; MICROSTRUCTURE;

EID: 0034026375     PISSN: 02641275     EISSN: None     Source Type: Journal    
DOI: 10.1016/s0261-3069(99)00096-5     Document Type: Article

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