The adhesion of substitution-deposited gold, silver and palladium films on copper substrates

Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals

Volumn 69, Issue 2, 2005, Pages 225-228

  Okamoto, Naoki ^a   Watanabe, Tohru ^a  

^a TOKYO METROPOLITAN UNIVERSITY   (Japan)

Author keywords

Adhesion; Deposition; Gold; Palladium; Silver

Indexed keywords

ADHESIVE PROPERTIES; ADHESIVE STRENGTH; CRYSTALLOGRAPHIC STRUCTURE; SUBSTITUTED-DEPOSITED FILMS;

ADHESION; COPPER; CRYSTAL STRUCTURE; DEPOSITION; ELECTRODEPOSITION; ETCHING; GOLD; MICROSTRUCTURE; MORPHOLOGY; PALLADIUM; SCANNING ELECTRON MICROSCOPY; SILVER; TRANSMISSION ELECTRON MICROSCOPY;

THIN FILMS;

EID: 17044433131     PISSN: 00214876     EISSN: None     Source Type: Journal    
DOI: 10.2320/jinstmet.69.225     Document Type: Article

References (4)

1. N. Okamoto and T. Watanabe: Collected Abstracts of the 2004 Autumn Meeting of the Japan Inst. Metals (2004) pp. 270.
2. N. Okamoto and T. Watanabe: J. Japan Inst. Metals 68 (2004) 110-1113.
3. N. Okamoto and T. Watanabe: J. Japan Inst. Metals.
4. H. Imai, T. Watanabe and Y. Tanabe: J. Metal Surface Finishing Society of Japan 34 (1983) 129-136.