Tensile properties and creep behavior of SiC-based fibers under various oxygen partial pressures

Materials Science Forum

Volumn 475-479, Issue II, 2005, Pages 1333-1336

  Sha, J J ^a   Park, J S ^b   Hinoki, T ^a   Kohyama, A ^a   Yu, J ^c  

^a KYOTO UNIVERSITY   (Japan)

^b Inst of Ener Sci and Technology   (Japan)

^c CHINA INSTITUTE OF ATOMIC ENERGY   (China)

Author keywords

Creep behavior; Oxygen partial pressure; SiC fibers; Tensile properties

Indexed keywords

CREEP; MICROSTRUCTURE; NUCLEAR ENERGY; OXYGEN; PARTIAL PRESSURE; PROTECTIVE ATMOSPHERES; SCANNING ELECTRON MICROSCOPY; STOICHIOMETRY; TENSILE PROPERTIES; X RAY DIFFRACTION;

BENDING STRESS RELAXATION; CERAMIC-MATRIX COMPOSITES; CREEP BEHAVIOR; HIGH TEMPERATURE TECHNOLOGIES;

SILICON CARBIDE;

EID: 17044405898     PISSN: 02555476     EISSN: 16629752     Source Type: Book Series    
DOI: 10.4028/0-87849-960-1.1333     Document Type: Conference Paper

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