Performance of epoxy encapsulants for optoelectronic packaging

2004 4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics

Volumn , Issue , 2004, Pages 211-215

  Rector, Louis ^a   Starkey, Dale ^a  

^a Henkel Technologies   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CASTING; EPOXY RESINS; LIGHT EMITTING DIODES; LIGHT TRANSMISSION; OPTOELECTRONIC DEVICES; THERMAL EXPANSION; THERMOPLASTICS;

CRACK RESISTANCE; EPOXY ENCAPSULANTS; LIQUID CASTING TECHNIQUE; OPTOELECTRONIC PACKAGING;

ELECTRONICS PACKAGING;

EID: 17044393526     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/polytr.2004.1402763     Document Type: Conference Paper

References (6)

1. M. Edwards and Y. Zhou, "Comparative Properties of Optically Clear Epoxy Encapsulants", Proceedings of the SPIE, Int. Soc. Opt. Eng., Vol. 4436, pp. 190-197, 2001.
2. D. Starkey, "New Types of Optoelectronic Molding Compounds", 48th Electronic Component and Technology Conference, pp. 1173-1177, 1998.
3. B. Ellis, Chemistry and Technology of Epoxy Resins, Blackie Academic, 1993.
4. N. Mills,"Optical Properties" in Encyclopedia of Polymer Science and Engineering, H. Mark, ed., Vol. 10, pp. 493-540, Wiley Interscience, 1987.
5. H. Lee and K. Neville, Handbook of Epoxy Resins, McGraw-Hill, 1967.
6. C. Bischof, "Relationship of Adhesion, Delamination, Preconditioning and Preplating Effects at the Plastic to Leadframe Interface", Proceedings of the 45th Electronic Components and Technology Conference, pp. 827-834, 1995. Version: July 2004 A