New types of optoelectronic molding compounds

Proceedings - Electronic Components and Technology Conference

Volumn Part F133492, Issue , 1998, Pages 1173-1177

  Starkey, D ^a  

^a Dexter Electronic Materials   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

MOLDING; NETWORK COMPONENTS; ELECTRONICS PACKAGING; GLASS TRANSITION; INTEGRATED OPTOELECTRONICS; MOISTURE; SURFACE MOUNT TECHNOLOGY; WATER ABSORPTION;

BOILING WATER; OPTICAL CLARITY;

SHEET MOLDING COMPOUNDS;

MOISTURE ABSORPTION; OPTOELECTRONIC SHEET MOLDING COMPOUNDS;

EID: 0031642328     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.1998.678865     Document Type: Conference Paper

References (2)

1. Anthony A. Gallo, Ramesh Munamarty, "Popcoming: A Failure Mechanism in Plastic-Encapsulated Microcircuits", Dexter Electronic Materials Technical Paper, September 1995, pg. 4
2. Paul V. Robock, Luu T. Nguyen, "Plastic Packaging", in Rao R. Tummala, Eugene J. Rymaszewski, Editors, Microelectronic Packaging Handbook. Van Nostrand Reinhold, NY, 1989, pg. 558