Diffusion annealing of copper-silver bimetallic strips at different temperatures

Materials Characterization

Volumn 47, Issue 3-4, 2001, Pages 269-274

  Meng, L ^a   Zhou, S P ^b   Yang, F T ^b   Shen, Q J ^b   Liu, M S ^a  

^a ZHEJIANG UNIVERSITY   (China)

^b KUNMING INSTITUTE OF PRECIOUS METALS   (China)

Author keywords

Bonding property; Cu Ag bimetallic strip; Diffusion annealing; Interface; Microstructure

Indexed keywords

ANNEALING; BIMETALS; BONDING; COLD ROLLING; HARDNESS; INTERFACES (MATERIALS); METAL CLADDING; METALLOGRAPHIC MICROSTRUCTURE; RECRYSTALLIZATION (METALLURGY); STRIP METAL; THERMAL EFFECTS;

BIMETALLIC STRIPS; DIFFUSION ANNEALING;

COPPER COMPOUNDS;

EID: 0035521377     PISSN: 10445803     EISSN: None     Source Type: Journal    
DOI: 10.1016/S1044-5803(01)00182-6     Document Type: Article

References (5)

1. Cold roll bonding of bimetallic sheets and strips
2. Monte Carlo simulation of the Cu-Ag (001) semicoherent interphase boundary
3. Silver tracer diffusion in oriented Ag/Cu interphase boundaries and correlation to the boundary structure
4. Microbeam analysis studies of the copper-silver interface