Multi-parameter homotopy for the numerical analysis of mems

Sensors and Actuators, A: Physical

Volumn 110, Issue 1-3, 2004, Pages 39-51

  König, Eva Renate ^a   Wachutka, Gerhard ^a  

^a TECHNICAL UNIVERSITY OF MUNICH   (Germany)

Author keywords

Electromechanical coupling; Homotopy method; MEMS device simulation

Indexed keywords

BOUNDARY ELEMENT METHOD; COMPUTER SIMULATION; DEFORMATION; ELECTRIC CHARGE; ELECTRIC POTENTIAL; ELECTROCHEMISTRY; ELECTRODES; PARTIAL DIFFERENTIAL EQUATIONS;

ELECTROMECHANICAL COUPLING; HOMOTOPY METHOD;

MICROELECTROMECHANICAL DEVICES;

EID: 1642566606     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.sna.2003.09.029     Document Type: Conference Paper

References (4)

1. König E.-R., Groth P., Wachutka G., New coupled-field device simulation tool for MEMS based on TP2000 CAD platform. Sens. Actuat. A. 76:1999;9-18.
2. R. Zengerle, Mikro-Membranpumpen als Komponenten für Mikro-Fluidsysteme, University of the Armed Forces, Shaker Publishers, Aachen, 1994.
3. A. Mayr, Institute for Physics of Electrotechnology, Munich University of Technology, private communication.
4. E.L. Allgower, K. Georg, Numerical Continuation Methods: An Introduction, Springer, New York, 1990.