New coupled-field device simulation tool for MEMS based on the TP2000 CAD platform

Sensors and Actuators, A: Physical

Volumn 76, Issue 1-3, 1999, Pages 9-18

  König, Eva Renate ^a   Groth, Peter ^b   Wachutka, Gerhard ^a  

^a TECHNICAL UNIVERSITY OF MUNICH   (Germany)

^b IGF Ingenieursozietat Groth Faiss   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

BOUNDARY ELEMENT METHOD; COMPUTER AIDED DESIGN; ELECTROSTATIC DEVICES; FINITE ELEMENT METHOD; INDUSTRIAL APPLICATIONS; MICROELECTROMECHANICAL DEVICES; NUMERICAL ANALYSIS;

ACCURACY; COUPLED FIELD SIMULATOR; ELECTROMECHANICAL MICRODEVICE; HOMOTOPY METHOD; MICROMIRROR; MULTIDIMENSIONAL NUMERICAL ANALYSIS; THERMOMECHANICAL ANALYSIS;

COMPUTER SIMULATION;

EID: 0343496767     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0924-4247(98)00285-4     Document Type: Article

References (4)

1. R.H.W. Hoppe, E.-R. Sieber, G. Wachutka, U. Wiest, Mathematical Modelling and Numerical Simulation of a Free Boundary Problem for an Electromechanical Micropump, Rep. No. 358, Institut für Mathematik, Universität Augsburg, Germany, 1996.
2. G. Löbel, W. Sichert, BETTI-Boundary Element Code for Heat Conduction, Forschungskuratorium Maschinenbau, Frankfurt, 1987.
3. R. Bausinger, H. Faiss, P. Groth, TPS10 Benutzerhandbuch, TSE, Reutlingen, 1993.
4. Jaecklin V.P., Linder C., de Rooij N.F., Moret J.-M., Vuilleumier R. Line-addressable torsional micromirrors for light modulator arrays. Sensors and Actuators A. 41-42:1994;324-329.