Thermal conductivity decomposition and analysis using molecular dynamics simulations Part II. Complex silica structures

International Journal of Heat and Mass Transfer

Volumn 47, Issue 8-9, 2004, Pages 1799-1816

  McGaughey, A J H ^a   Kaviany, M ^a  

^a UNIVERSITY OF MICHIGAN   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

AMORPHOUS MATERIALS; CHEMICAL BONDS; COMPUTER SIMULATION; CRYSTALLIZATION; DECOMPOSITION; MOLECULAR DYNAMICS;

ATOMIC STRUCTURES; THERMAL TRANSPORT MECHANISMS;

THERMAL CONDUCTIVITY;

THERMAL CONDUCTIVITY;

EID: 1642538372     PISSN: 00179310     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ijheatmasstransfer.2003.11.009     Document Type: Article

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