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Volumn 46, Issue 2, 2004, Pages 74-89

Meeting the closed-loop challenge: The case of remanufacturing

Author keywords

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Indexed keywords


EID: 1642401176     PISSN: 00081256     EISSN: None     Source Type: Journal    
DOI: 10.2307/41166211     Document Type: Review
Times cited : (163)

References (30)
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    • An Examination of Reverse Logistics Practices
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    • The Aftermarket: It's Where the Money Is
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    • note
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    • The 'Green Design Advisor': A Tool for Design for Environment
    • Please refer to S. Carlson-Skalak, J. Leschke, M. Sondeen, and P. Gelardi, "E Media's Global Zero: Design for Environment in a Small Firm," Interfaces, 30/3 (2000): 66-82; K. Feldman, O. Meedt, S. Trautner, H. Scheller, and W. Hoffman, "The 'Green Design Advisor': A Tool for Design for Environment," Journal of Electronics Manufacturing, 9/1 (1999): 17-28; L.K. Moyer and S.M. Gupta, "Environmental Concerns and Recycling/Disassembly Efforts in the Electronics Industry," Journal of Electronics Manufacturing, 7/1 (1997): 1-22; Toffel, op. cit.
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    • Environmental Concerns and Recycling/Disassembly Efforts in the Electronics Industry
    • Please refer to S. Carlson-Skalak, J. Leschke, M. Sondeen, and P. Gelardi, "E Media's Global Zero: Design for Environment in a Small Firm," Interfaces, 30/3 (2000): 66-82; K. Feldman, O. Meedt, S. Trautner, H. Scheller, and W. Hoffman, "The 'Green Design Advisor': A Tool for Design for Environment," Journal of Electronics Manufacturing, 9/1 (1999): 17-28; L.K. Moyer and S.M. Gupta, "Environmental Concerns and Recycling/Disassembly Efforts in the Electronics Industry," Journal of Electronics Manufacturing, 7/1 (1997): 1-22; Toffel, op. cit.
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  • 30
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    • Please refer to S. Carlson-Skalak, J. Leschke, M. Sondeen, and P. Gelardi, "E Media's Global Zero: Design for Environment in a Small Firm," Interfaces, 30/3 (2000): 66-82; K. Feldman, O. Meedt, S. Trautner, H. Scheller, and W. Hoffman, "The 'Green Design Advisor': A Tool for Design for Environment," Journal of Electronics Manufacturing, 9/1 (1999): 17-28; L.K. Moyer and S.M. Gupta, "Environmental Concerns and Recycling/Disassembly Efforts in the Electronics Industry," Journal of Electronics Manufacturing, 7/1 (1997): 1-22; Toffel, op. cit.
    • Journal of Electronics Manufacturing
    • Toffel1


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