Compositional effects on electrical and mechanical properties in carbon-doped oxide dielectric films: Application of Fourier-transform infrared spectroscopy

Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures

Volumn 22, Issue 1, 2004, Pages 196-201

  Andideh, Ebrahim ^a   Lerner, Michael ^a   Palmrose, Gerald ^a   El Mansy, Safaa ^a   Scherban, Tracey ^a   Xu, Guanghai ^a   Blaine, Jeanette ^a  

^a INTEL CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CROSSLINKING; CURVE FITTING; DOPING (ADDITIVES); ELASTIC MODULI; EXTRAPOLATION; FOURIER TRANSFORM INFRARED SPECTROSCOPY; GLASS; HARDNESS; MICROPROCESSOR CHIPS; PERMITTIVITY; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; SILANES; SILICATES; SPECTROMETERS;

CARBON-DOPED OXIDES (CDO) FILMS; COHESIVE STRENGTH (CS);

DIELECTRIC FILMS;

EID: 1642328838     PISSN: 10711023     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.1640401     Document Type: Conference Paper

References (5)

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2. T. Scherban, B. Sun, J. Blaine, C. Block, B. Jin, and E. Andideh, in 2001 IEEE International Interconnect Technology Conference Proceedings (IEEE, New York, 2001), pp. 257-259.
3. L. Han, J. Pan, S. Chen, N. Balasubramanian, J. Shi, L. Wong, and P. Foo, J. Electrochem. Soc. 148, F148 (2001).
4. N. Mastuki, A. Matsunoshita, J. Lee, Y. Morisada, Y. Naito, and C. Merritt, in 2000 Dielectrics for ULSI Multilevel Interconnection Conference Proceedings, DUMIC, 2001, pp. 151-160.
5. G. Xu, J. He, E. Andideh, J. Bielefeld, and T. Scherban, in 2002 IEEE International Interconnect Technology Conference Proceedings, Poster Session 3.11 (unpublished).