Analysis of joining boundary between Ni-P electroless plate and solder by EPMA scatter diagram method (I)

Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals

Volumn 68, Issue 1, 2004, Pages 8-13

  Kimura, Takashi ^a   Sugizaki, Takashi ^b   Nishida, Kenji ^a   Ishikawa, Nobuhiro ^a   Tanuma, Shigeo ^a  

^a NATIONAL INSTITUTE FOR MATERIALS SCIENCE   (Japan)

^b Meltex Incorporation   (Japan)

Author keywords

Electron probe micro analyzer; NiSn compound; Scatter diagram method; Tin and lead (Sn Pb) solder; X ray image

Indexed keywords

BONDING; CRACK PROPAGATION; ELECTROLESS PLATING; FRACTURE; INTERFACES (MATERIALS); PHASE DIAGRAMS; SOLDERING ALLOYS; X RAY SCATTERING;

ELECTRON PROBE MICROANALYZERS; NICKEL LEAD SOLDER;

NICKEL ALLOYS;

EID: 1642324335     PISSN: 00214876     EISSN: None     Source Type: Journal    
DOI: 10.2320/jinstmet.68.8     Document Type: Article

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