Collapse of microchannels during anodic bonding: Theory and experiments

Journal of Applied Physics

Volumn 95, Issue 5, 2004, Pages 2800-2808

  Shin, Wen Pin ^a   Hui, Chung Yuen ^a   Tien, Norman C ^b  

^a Department of Obstetrics Gynecology   (United States)

^b University of California   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ANODIC BONDING; MECHANICAL ISOLATION; MICROCHANNELS;

ANODES; ASPECT RATIO; DEFORMATION; ELASTIC MODULI; ELECTRIC FIELD EFFECTS; ELECTROSTATICS; PERMITTIVITY; POLARIZATION; SILICON WAFERS; STIFFNESS;

BONDING;

EID: 1642321075     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.1644898     Document Type: Article

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