Uniform electrochemical deposition of copper onto self-assembled gold nanoparticles

Journal of Physical Chemistry B

Volumn 108, Issue 11, 2004, Pages 3535-3539

  Cao, Linyou ^a   Diao, Peng ^a,b   Zhu, Tao ^a   Liu, Zhongfan ^a  

^a PEKING UNIVERSITY   (China)

^b BEIHANG UNIVERSITY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

COLLOIDS; COMPOSITION EFFECTS; DEPOSITION; ELECTROCHEMISTRY; ELECTROLYTES; GOLD; MATHEMATICAL MODELS; NANOSTRUCTURED MATERIALS; PARTICLE SIZE ANALYSIS; SELF ASSEMBLY; SURFACES;

CORE-SHELL PARTICLES; ELECTROCHEMICAL DEPOSITION; SELF-ASSEMBLED GOLD NANOPARTICLES; SURFACE CONCENTRATION;

COPPER;

EID: 1642284998     PISSN: 15206106     EISSN: None     Source Type: Journal    
DOI: 10.1021/jp036688u     Document Type: Article

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