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Volumn , Issue , 2004, Pages 207-210

The applications of EBG structures in power/ground plane pair SSN suppression

Author keywords

[No Author keywords available]

Indexed keywords

BLOCK BANDS; CAPACITOR ARRAYS; DECOUPLING CAPACITORS; ELECTROMAGNETIC BAND GAP (EBG);

EID: 15944428595     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper
Times cited : (5)

References (9)
  • 1
    • 0031333784 scopus 로고    scopus 로고
    • Packaging and power distribution design considerations for sun microsystems desktop workstation
    • Oct.
    • L. Smith, "Packaging and Power Distribution Design Considerations for Sun Microsystems Desktop Workstation", IEEE 6th Topical Meeting on Electrical Performance of Electronic Packaging, pp. 19-22, Oct. 1997.
    • (1997) IEEE 6th Topical Meeting on Electrical Performance of Electronic Packaging , pp. 19-22
    • Smith, L.1
  • 2
    • 15944390091 scopus 로고    scopus 로고
    • Power integrity and ground bounce simulation of high speed PCBs
    • Ansoft
    • "Power Integrity and Ground Bounce Simulation of High Speed PCBs", Ansoft, Empowering Profitability worldwide workshop, 2002.
    • (2002) Empowering Profitability Worldwide Workshop
  • 5
    • 10744230780 scopus 로고    scopus 로고
    • Design methodology for sievenpiper high-impedance surfaces: An artificial magnetic conductor for positive gain electrically small antennas
    • Oct.
    • S. Clavijo, R. E. Diaz, W. E. McKinzie III, "Design Methodology for Sievenpiper High-Impedance Surfaces: An Artificial Magnetic Conductor for Positive Gain Electrically Small Antennas", IEEE Trans on AP, Vol. 51, No. 10, pp 2678-2690. Oct. 2003.
    • (2003) IEEE Trans on AP , vol.51 , Issue.10 , pp. 2678-2690
    • Clavijo, S.1    Diaz, R.E.2    McKinzie III, W.E.3
  • 6
    • 0037250704 scopus 로고    scopus 로고
    • A novel power plane with integrated simultaneous switching noise mitigation capability using high impedance surface
    • Jan.
    • T. Kamgaing, O. M. Ramahi, "A Novel Power Plane With Integrated Simultaneous Switching Noise Mitigation Capability Using High Impedance Surface", IEEE Microwave and Wireless Components Letters, Vol. 13, No. 1, Jan. 2003.
    • (2003) IEEE Microwave and Wireless Components Letters , vol.13 , Issue.1
    • Kamgaing, T.1    Ramahi, O.M.2
  • 7
    • 0742269745 scopus 로고    scopus 로고
    • Simultaneous switching noise mitigation in PCB using cascaded high-impedance surfaces
    • Jan.
    • S. Shahparnia, O.M. Ramahi, "Simultaneous Switching Noise Mitigation in PCB Using Cascaded High-impedance Surfaces", Electronics Letters, Vol. 40 No. 2, Jan. 2004.
    • (2004) Electronics Letters , vol.40 , Issue.2
    • Shahparnia, S.1    Ramahi, O.M.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.