Increased feedback due to package mounting

IEEE Topical Meeting on Electrical Performance of Electronic Packaging

Volumn , Issue , 2004, Pages 49-52

  Aaen, Peter H ^a   Plá, Jaime A ^a   Balanis, Constantine A ^b  

^a FREESCALE SEMICONDUCTOR INC   (United States)

^b Arizona State University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRICAL DISCONTINUITY; PACKAGE MOUNTING; PACKAGED TRANSISTORS; TRANSVERSE-ELECTROMAGNETIC (TEM) WAVE;

COMPUTER AIDED DESIGN; DIELECTRIC MATERIALS; ELECTROMAGNETIC WAVES; FEEDBACK; HEAT SINKS; MAGNETIC FIELD EFFECTS; PRINTED CIRCUIT BOARDS; SOLDERING; TRANSISTORS;

ELECTRONICS PACKAGING;

EID: 15944403213     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)

1. R. E. Collins, Field Theory of Guided Waves. IEEE Press, 1991.
2. D. M. Pozar, Microwave Engineering. Addison-Wesley, 1993.
3. W. Struble, A. Platzker, S. Nash, and J. A. Plá, "A new small signal MESFET and HEMT model compatible with large signal modeling," in IEEE MTT-S Symp. Dig., vol. 3, May 1994, pp. 1567-1570.
4. A. Wood, C. Dragon, and W. Burger, "High performance silicon LDMOS technology for 2 GHz RF power amplifier applications," in Proc. IEEE IEDM Symp., Dec. 1996, pp. 87-90.