Measurement of milliohms of impedance at hundred MHz on chip power supply loop

IEEE Topical Meeting on Electrical Performance of Electronic Packaging

Volumn 2002-January, Issue , 2002, Pages 319-322

  Kantorovkh, Isaac ^a   Houghton, Chris ^a   Root, Steve ^a   St Lraurent, Jim ^a  

^a HEWLETT PACKARD COMPANY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC POWER SYSTEMS; ELECTRONICS PACKAGING;

COMPUTER INSTRUCTIONS; HIGH FREQUENCY IMPEDANCE; ON CHIPS; SUPPLY LOOP;

CHIP SCALE PACKAGES;

EID: 15944377615     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPEP.2002.1057941     Document Type: Conference Paper

References (4)

1. l.C. Houghton, M. Tsuk, R.Dame, and J. St. Lauren4 "Modeling and Measurement of Alpha 21364 Package," in Proceedings of IEEE IO' EPEP Topical Meeting, pp. 283, Cambridge, 2001.
2. I.Novak, "Probes and Setup for Measuring Power-Plane Impedances with Vector Network Analyzer," Designcon 1999, Proceedings of High Performance Systems Design Conference, pp.20 1-215, Santa Clara 1999.
3. I.Novak, "Measuring Milliohms and PicoHenrys in Power Distribution Networks," DesignCon2000, Santa Clara, 2000.
4. S.Chun, L. Smith, R. Anderson, and M. Swaminathan, "Model of Hardware Correlation for Power Distribution Induced VO Noise in a Functioning Computer System," ECTC Conference Record, San Diego, CA, pp.3 19-324, May 2002.