Noise reduction in digital / RF daughter card with electromagnetic bandgap layers

IEEE Topical Meeting on Electrical Performance of Electronic Packaging

Volumn , Issue , 2004, Pages 203-206

  Rogers, Shawn ^a   Wu, Xin ^a   Waltho, Alan ^b   Xu, David ^b  

^a Etenna Corporation   (United States)

^b INTEL CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DATA RATES; ELECTROMAGNETIC BANDGAP (EBG) LAYERS; NOISE COUPLING; RF CIRCUITS;

COMPUTER ARCHITECTURE; COMPUTER HARDWARE; DIGITAL CIRCUITS; ELECTROMAGNETISM; FABRICATION; LAPTOP COMPUTERS; RADIO EQUIPMENT; SWITCHING;

NOISE ABATEMENT;

EID: 15944361903     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)

1. R. Abhari and G. V. Elefiheriades, "Suppression of the parallel-plate noise in high speed circuits using a metallic electromagnetic band-gap structure," 2002 IEEE MTT-S Int. Microwave Symp. Dig, June 2002, pp. 493-496.
2. T. Kamgaing and O. M. Ramahi, "High-impedance electromagnetic surfaces for parallel-plate mode suppression in high speed digital systems," IEEE 11th Topical Meeting on Electrical Performance of Electronic Packaging, Oct 21-23, 2002, Monterey, CA, pp. 279-282.
3. D. Sievenpiper, "High-Impedance Electromagnetic Surfaces," Ph.D. Dissertation, 1999, Electrical Engineering Dept., UCLA.
4. W. McKinzie, 'Circuit and method for suppression of transverse electromagnetic modes", U.S. Patent Application Serial No. 60/477,152, filed June 9,2003.
5. S. Rogers, "Noise reduction in digital / RF daughter card with electromagnetic bandgap layers", internal Etenna white paper, June 2, 2004.