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Volumn 28, Issue 2, 2005, Pages 359-363

Enhancement of thermal performance in a sintered miniature heat pipe

Author keywords

Heat transfer enhancement; Miniature heat pipe; Mixing powder

Indexed keywords

COPPER; FRICTION; HEAT RESISTANCE; HEAT TRANSFER; MINIATURE INSTRUMENTS; POROSITY; REYNOLDS NUMBER; SINTERING; SPECIFIC HEAT; SURFACE TENSION; THERMOANALYSIS; VAPORIZATION;

EID: 15844391293     PISSN: 02533839     EISSN: 21587299     Source Type: Journal    
DOI: 10.1080/02533839.2005.9671001     Document Type: Article
Times cited : (7)

References (17)
  • 1
    • 1242328918 scopus 로고    scopus 로고
    • Advanced Heat Pipe Thermal Solutions for Higher Power Notebook Computers
    • Lancaster, PA, USA: Thermacore Inc.
    • Ali, A., DeHoff, R., and Grubb, K., 1999. “Advanced Heat Pipe Thermal Solutions for Higher Power Notebook Computers,”. In Technical Paper, Lancaster, PA, USA:Thermacore Inc.
    • (1999) Technical Paper
    • Ali, A.1    DeHoff, R.2    Grubb, K.3
  • 2
    • 15844414559 scopus 로고
    • Deland, FL, USA
    • Brunswick Corporation. 1979. Product Data Deland, FL, USA
    • (1979) Product Data
  • 5
    • 0002137146 scopus 로고    scopus 로고
    • Proceedings of the 5th International Heat Pipe Conference, Tsukuba, Japan
    • Cotter, T. P., “Principles and Prospects for Micro Heat Pipes,”. Proceedings of the 5th International Heat Pipe Conference. pp. 328–335. Tsukuba, Japan
    • Principles and Prospects for Micro Heat Pipes , pp. 328-335
    • Cotter, T.P.1
  • 8
    • 85023905045 scopus 로고    scopus 로고
    • Fujikura Thermal Technology Global Support
    • Kyoto, Japan
    • Fujikura Ltd. 2000. “Fujikura Thermal Technology Global Support,”. In Product Data Kyoto, Japan
    • (2000) Product Data
  • 10
    • 0037544147 scopus 로고    scopus 로고
    • Heat Pipe Cooling Technology for Desktop PC CPU
    • Kim, K. S., Won, M. H., Kim, J. W., and Back, B. J., 2003. “Heat Pipe Cooling Technology for Desktop PC CPU,”. Applied Thermal Engineering, 23 (9):1137–1144.
    • (2003) Applied Thermal Engineering , vol.23 , Issue.9 , pp. 1137-1144
    • Kim, K.S.1    Won, M.H.2    Kim, J.W.3    Back, B.J.4
  • 16
    • 0015991376 scopus 로고
    • Analysis of the Effects of Vapor Pressure Drop on Heat Pipe Performance
    • Tien, C. L., and Rohani, A. R., 1974. “Analysis of the Effects of Vapor Pressure Drop on Heat Pipe Performance,”. International Journal of Heat and Mass Transfer, 17 (1):61–67.
    • (1974) International Journal of Heat and Mass Transfer , vol.17 , Issue.1 , pp. 61-67
    • Tien, C.L.1    Rohani, A.R.2
  • 17
    • 0031631129 scopus 로고    scopus 로고
    • Proceedings of I-Therm'98, The 6th Intersociety Conference on Thermal Phenomena in Electronic Systems, Seattle, WA, USA
    • Xie, H., Ali, A., and Bhatia, R., “The Use of Heat Pipes in Personal Computers,”. Proceedings of I-Therm'98, The 6th Intersociety Conference on Thermal Phenomena in Electronic Systems. pp. 442–448. Seattle, WA, USA
    • The Use of Heat Pipes in Personal Computers , pp. 442-448
    • Xie, H.1    Ali, A.2    Bhatia, R.3


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.