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Volumn 45, Issue 3-4, 2005, Pages 611-622

Novel concepts for reliability technology

Author keywords

[No Author keywords available]

Indexed keywords

CUSTOMER SATISFACTION; DURABILITY; FAILURE ANALYSIS; PRODUCT DESIGN; QUALITY ASSURANCE; SALES;

EID: 15744406016     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2004.10.010     Document Type: Article
Times cited : (51)

References (25)
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  • 2
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    • M. Pecht, and Nash F. Predicting the reliability of electronic equipment Proc IEEE 82 7 1994 992 1004
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    • The Transition from statistical-field failure based models to physics-of-failure based models for reliability assessment of electronic packages
    • Lahaina, Maui, HI
    • Stadterman T, Cushing M, Hum B, Malhotra A, Pecht M. The Transition from statistical-field failure based models to physics-of-failure based models for reliability assessment of electronic packages. In Proceedings of the INTERpack' 95, Lahaina, Maui, HI, 1995. p. 619-25
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  • 12
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    • A. Dasgupta, and M. Pecht Failure mechanisms and damage models IEEE Trans. Reliab. 40 5 1991 531
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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.