Assessment of melting behavior of Cu-coated Ti powders using thermal analysis

Materials Science and Engineering: A

Volumn 369, Issue 1-2, 2004, Pages 56-65

  Brochu, M ^a   Corbin, S F ^b   Pugh, M D ^c   Drew, R A L ^a  

^a MCGILL UNIVERSITY   (Canada)

^b UNIVERSITY OF WATERLOO   (Canada)

^c Dept of Electrical and Computer Engineering   (Canada)

Author keywords

Active brazing alloy; Cu; DSC; Melting; Ti

Indexed keywords

ALLOYS; INTERMETALLICS; MELTING; MIXTURES;

ACTIVE BRAZING ALLOYS (ABA); INTERMETALLIC FORMATION;

MATERIALS SCIENCE;

MELTING;

EID: 1542400037     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2003.10.272     Document Type: Article

References (12)

1. M.G. Nicholas, Joining Processes Introduction to Brazing and Diffusion Bonding, Kluwer Academic Publishers, 1998.
2. G.S. Upadhyaya, Powder Metallurgy Technology, Cambridge International Science Publishing, 1997.
3. D.R. Gaskell, Introduction to the Thermodynamics of Materials, third ed., Taylor - Francis, Washington, 1995.
4. O. Kubaschewski, C.B. Alcock, Metallurgical Thermochemistry, fifth ed., Pergamon Press, Oxford, 1979.
5. M.G. Nicholas, Active Metal Brazing, Joining of Ceramics, Institute of Ceramics, Chapman and Hall, 1990.
6. ASM Handbook: Phase Diagrams, vol. 3 (2), ASM International, 1994, p. 180.
7. Brochu M.Pugh M.D.Drew R.A.L. Ceram. Eng. Sci. Proc. 233 2002 801
8. Corbin S.F.Lucier P. Met. Mater. Trans. A 32A 2001 971
9. Corbin S.F. Met. Mater. Trans. A 33A 2002 117
10. S.D. Peteves, G. Ceccone, M. Paulasto, V. Stamos, P. Yvon, JOM, January (1996) 48, 74.
11. Adams D.Alford T.L.Rafalski S.A.Rack M.J.Russell S.W.Kim M.J.Mayer J.W. Mater. Chem. Phys. 43 1996 145
12. Adams D.Alford T.L.Theodore N.D.Russell S.W. Thin Solid Films 270 1995 346