Novel bulk acoustic wave hammer to determinate the dynamic response of microstructures using pulsed broad bandwidth ultrasonic transducers

American Society of Mechanical Engineers, Micro-Electromechanical Systems Division Publication (MEMS)

Volumn 3, Issue , 2001, Pages 199-206

  Lai, Wen Pin ^a   Ho, Yi Ping ^a   Fang, Weileun ^a  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ACOUSTIC WAVES; BANDWIDTH; DYNAMIC RESPONSE; ELASTIC MODULI; FATIGUE OF MATERIALS; MICROSTRUCTURE; NATURAL FREQUENCIES; RESIDUAL STRESSES; THERMAL LOAD; ULTRASONIC TRANSDUCERS;

ACOUSTIC WAVE HAMMER; PULSED BROAD BANDWIDTH;

MICROELECTROMECHANICAL DEVICES;

EID: 1542399041     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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